RPS-CH24P1 Remote Plasma Source for High Flow Applications
RPS-CH24P1 Remote Plasma Source for High Flow Applications
The RPS-CH24P1, 24 kW remote plasma source is designed for use with larger Atomic Layer Deposition (ALD) and Quad-style Chemical Vapor Deposition (CVD) chambers used in Semiconductor, Flat Panel Display, or Photovoltaic (PV) processes. A split-powered DC/RF design consisting of a rack mounted DC power supply and a 24 kW RF remote toroidal applicator head provides highly efficient destruction of NF3 molecules for chamber clean applications or high flow mixed gas species applications.
- Compact split applicator power design provides easy integration to OEM process chambers
- Increased Fluorine radical output shortens clean time cycles
- EtherCAT® communication enables fast, reliable data streaming and unit control
- A new plasma block assembly results in fast turn maintenance See All Features
| Compare | Description | Drawings, CAD & Specs | Avail. | Price | ||
|---|---|---|---|---|---|---|
 | RPS-CH24P1-P24CRemote Plasma Source, 24 kW, High Flow Applications |
Specifications
- TypeRPS-CH24P1 Remote Plasma Source
- Power Output24 kW
- RF Frequency400 kHz
- Accuracy±1% to power set point
- Gas Supply During IgnitionAr
- NF3 Operation Reactant Output1-25 slm 20T
- Compatible SpeciesNF3, O2, N2, Ar
- Mixed Species Space30-90 slm
- THD<15%
- Inlet Gas ConnectionKF40
- Outlet Gas ConnectionKF50
- Cooling Water RequiredRemote Head: 3 gpm (11.36 Lpm)
DC Power Supply: 2 gpm (7.57 Lpm) - Control InterfaceAnalog: DB25
Digital: EtherCAT - Power Requirements208 V, 3 phase 50/60 Hz, 75 Amps RMS max phase
- DimensionsRemote Head: 22.02 x 10.76 x 11.1 in. (55.93 x 27.33 x 28.19 cm)
Power Supply: 21.24 x 19.00 x 7.0 in. (53.95 x 48.26 x 17.78 cm) - WeightRemote Head: 100 lbs. (45.36 kg)
Power Supply: 62 lbs. (28.12 kg) - ComplianceSEMI F47
Features
RPS-CH24P1 Features
- Power Architecture
24 kW RF power output
±1% accuracy to power setting
DC boost power regulation - Process
NF3 species for chamber clean
Mixed gas species capable
Supports NF3, O2, N2, Ar - Maintenance
Plasma Electrolytic Oxide plasma block coatings for extended block life, lower operating expenses
The split power train design allows for greater flexibility in chamber installations and easy access for servicing without breaking chamber vacuum. The RF powertrain remains coupled to the toroidal applicator head for greater plasma stability while the DC rectified power Product Features supply provides a SEMI F47 compliant source of power to the applicator head. A new magnetics design combined with new power boost electronics reduces power losses, enhances ignition repeatability, and increases plasma stability, resulting in improved reliability and repeatable performance.
Equipped with EtherCAT® communication protocols, the RPS-CH24P1 streams key parametric data enabling ontool or in-fab diagnostics. The actively cooled MKS lowfield toroidal applicator and proprietary, high purity Al2O3 coating deliver extremely long plasma applicator lifetimes to reduce fab operation expenses. When the unit does require routine maintenance, servicing the plasma block applicator can be accomplished without removing the power electronics, reducing service times.
Resources
Literature
Drawings & CADs
RPS-CH24P1 Remote Plasma Source Dimensional Drawings(387 kB, PDF)