The HyperPAC Industrial PC programmable control solution delivers top of the line performance with reliable operation for a variety of control and automation tasks. Compared to standard IPCs, the HyperPAC provides a highly compact, fanless solution, with existing expandable IO via PCIe, along with flexibility to expand and configure the system. The HyperPAC is a flexible, scalable solution for numerous applications and project requirements which enables IIoT (Industrial Internet of Things) integration.
Advancements in data accessibility along with reduced data storage costs have resulted in a tremendous demand for improved automation control and data analysis. The future of industry 4.0 smart factory and intelligent manufacturing movements begin with the MKS HyperPAC. MKS' solution will simplify integrating sensors and their corresponding data, structure data from multiple sources, perform real-time analysis of the data, and therefore create actionable information, and visualizations of this information which can be customized for various users.
- Ease of fieldbus protocols integration with IIoT solution
- Compact form factor
- Flexible configuration See All Features
| Compare | Description | Drawings, CAD & Specs | Avail. | Price | ||
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![]() | AS08640G-08Industrial PC, Xeon CPU, 32GB ECC DRAM, with PWM Fan Option |
Specifications
- CPU TypeIntel Xeon E3-1268L v5, 2.40 GHz, 35W
- Storage DeviceOne 2.5 in. Drive Bay SSD removable,
One 2.5 in. Drive Bay SSD fixed - Chip SetIntel C236 PCH
- MemoryTwo DR4 16GB ECC SODIMM, up to 32GB
- Operating SystemWindows® 10 IoT Enterprise LTSB, TenAsys INtime RTOS for Windows
- DisplayTwo HDMI type A for HDMI v1.4b
One VGA - USB PortFront: Two USB 2.0 type A connectors
Back: Four USB 3.0 type A connectors - EthernetFive RJ45 Connectors for GbE (Intel I211AT x I219LM x 1)
- AudioTwo (MIC-in, Line-out)
- Power InterfaceTwo on/off switches (1 front, 1 back)
2 pin remote power on/off connector
3 pin DC power input (+, -, GND) - CommunicationDB-9 port (RS-232/422/485)
- Expansion Slots1: Full size mini card (PCIe)
2: Full size mini card (PCIe)
3: PCIEx[1] * 1
- Power Input12 - 24 VDC
- Power ConsumptionMax 35 W (CPU), 120W (Adapter)
- MountingWallmount (horizontal and vertical)
- Dimensions195 x 110 x 260 mm (WxHxD)
- Weight9.9 lb (4.9 kg)
- Operating Temperature Range0 ~ 55°C according to IEC60068-2 with 0.5m/s airflow (with smart fan)
- Storage Temperature-40 ~ 80°C
- Relative Humidity5 - 95%, @ 40°C, non-condensing
- VibrationRandom, 1GRMS, 5~500Hz, anti-vibration design
- Shock Tolerance/Immunity15 G (1/2 sine, 11 ms)
- ComplianceCE, FCC Class A
Resources
Application Notes
Leveraging IIoT for Edge Analytics and the Semiconductor Smart Fab(1,023.3 kB, PDF)


